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Title:
A manufacturing method of a radiating member with an adhesives layer, and a manufacturing method of a semiconductor device
Document Type and Number:
Japanese Patent JP6059964
Kind Code:
B2
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Inventors:
Osamu Kato
Application Number:
JP2012250488A
Publication Date:
January 11, 2017
Filing Date:
November 14, 2012
Export Citation:
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Assignee:
Nitto Shinko Co., Ltd.
International Classes:
H01L23/40; H01L23/373
Domestic Patent References:
JP2005072082A
JP8148627A
JP2011178894A
JP2008255186A
JP2002069392A
Attorney, Agent or Firm:
Noboru Fujimoto
Hiroaki Nakatani



 
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