Title:
RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017145334
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which has a curing temperature equivalent to that of an epoxy resin, and has further improved heat resistance than that of the epoxy resin.SOLUTION: A resin composition contains powder of a maleimide resin, and a resin having a glass transition point lower than a glass transition point of the maleimide resin. The resin having the glass transition point lower than the glass transition point of the maleimide resin is an epoxy resin. The resin composition is a resin cured at a curing temperature of the epoxy resin. The powder of the maleimide resin is mixed in an amount of 50 wt.% to 80 wt.% with respect to the epoxy resin.SELECTED DRAWING: Figure 1
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Inventors:
NAKAMATA YUKO
ICHIMURA YUJI
ICHIMURA YUJI
Application Number:
JP2016028703A
Publication Date:
August 24, 2017
Filing Date:
February 18, 2016
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
C08L35/00; C08G59/40; C08L63/00; C08L101/00; H01L23/29; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| JP2012188629A | 2012-10-04 | |||
| JP2014521754A | 2014-08-28 | |||
| JPH0848846A | 1996-02-20 | |||
| JPH0264113A | 1990-03-05 | |||
| JPH04277517A | 1992-10-02 | |||
| JPH01188518A | 1989-07-27 | |||
| JPH11111908A | 1999-04-23 |
Foreign References:
| KR20150037685A | 2015-04-08 |
Attorney, Agent or Firm:
Akinori Sakai