Title:
Method for manufacturing resin composition
Document Type and Number:
Japanese Patent JP6304803
Kind Code:
B2
Abstract:
The invention relates to a method for preparing a resin composition. According to the method, provided by the invention, for preparing the resin composition, a filling material can be used at a state closer to a primary particle size in such a manner that dispersity of the filling material in a resin is improved, so glueyness and other physical properties can be improved. According to the method for preparing the resin composition, the resin composition contains a filling material (a) the average particle size of which is A[[mu]m], a filling material (b) the average particle size of which is B[[mu]m] and a curing compound (c), the A[[mu]m] and the B[[mu]m] meet conditions shown in the following formulas (I) and (II); and the method comprises a step that the filling material (a) and the filling material (b) are stirred and mixed before the filling material (a) and the filling material (b) are dispersed in the curing compound (c). The formula (I) is 3[mu]m<=A<=20[mu]m, and the formula (II) is 0.0005*A<=B<=0.020*A.
Inventors:
Masanori Hashimoto
Daisuke Imaoka
Daisuke Imaoka
Application Number:
JP2014007383A
Publication Date:
April 04, 2018
Filing Date:
January 20, 2014
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08J3/20; C08K3/22; C08K3/36; C08L63/00; C09J11/04; C09J11/08; C09J163/00
Domestic Patent References:
| JP2011105898A | ||||
| JP2011008048A | ||||
| JP2011241279A | ||||
| JP2013203688A | ||||
| JP2009074067A | ||||
| JP2011105911A | ||||
| JP5058698A | ||||
| JP10033963A | ||||
| JP2137715A | ||||
| JP2010014771A |
Foreign References:
| WO2004055099A1 |