Title:
A manufacturing method of a scintillator array
Document Type and Number:
Japanese Patent JP5935919
Kind Code:
B2
Abstract:
A method for producing a scintillator array comprising fixing a scintillator substrate to a support plate via a double-coated adhesive sheet, at least an adhesive surface thereof to be in contact with the scintillator substrate being thermally peelable; providing the scintillator substrate with lattice-patterned grooves to form pluralities of scintillator cells; filling gaps between the scintillator cells with a liquid hardening reflector resin; curing the liquid hardening reflector resin by heating to form a resin-hardened scintillator cell body; and then peeling the double-coated adhesive sheet from the resin-hardened scintillator cell body by heating.
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Inventors:
Nitta Hideo
Application Number:
JP2015076755A
Publication Date:
June 15, 2016
Filing Date:
April 03, 2015
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
G01T1/20; G21K4/00
Domestic Patent References:
| JP4273087A | ||||
| JP2000098041A | ||||
| JP2012007948A |
Foreign References:
| WO2012147747A1 |
Attorney, Agent or Firm:
Takaishi Tachibana
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