Title:
半導体装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5573645
Kind Code:
B2
Abstract:
A semiconductor device includes: a substrate; a semiconductor element installed on the substrate so that a surface formed with an electrode is directed to the substrate; a chip capacitor installed on the substrate; and a conductive material covering a rear surface opposite to the surface of the semiconductor element and joining to one terminal electrode of the chip capacitor.
Inventors:
Ibara 匠
Seiji Ueno
Fujimori 城次
Yasunori Fujimoto
Seiji Ueno
Fujimori 城次
Yasunori Fujimoto
Application Number:
JP2010279284A
Publication Date:
August 20, 2014
Filing Date:
December 15, 2010
Export Citation:
Assignee:
FUJITSU semiconductor incorporated company
International Classes:
H01L25/00; H01L23/00
Attorney, Agent or Firm:
Hirakawa 明
Daisuke Takada
Tsutomu Toyama
Daisuke Takada
Tsutomu Toyama
Previous Patent: JPS5573644
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