A manufacturing method of a semiconductor device and a semiconductor device

Title:

A manufacturing method of a semiconductor device and a semiconductor device

Document Type and Number:

Japanese Patent JP5914097

Kind Code:

B2

Inventors:

Makoto Kuwabara
Shoichi Kaneko
Hirofumi Aoki
Tomita Eiki

Application Number:

JP2012076208A

Publication Date:

May 11, 2016

Filing Date:

March 29, 2012

Export Citation:

Assignee:

Toyota Central R & D Labs.
TOYOTA JIDOSHA KABUSHIKI KAISHA

International Classes:

H01L21/338; H01L21/336; H01L29/778; H01L29/78; H01L29/812

Domestic Patent References:

Attorney, Agent or Firm:

Kaiyu International Patent Office

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