Title:
A manufacturing method of a semiconductor device and a semiconductor device
Document Type and Number:
Japanese Patent JP5939055
Kind Code:
B2
Abstract:
To provide a semiconductor device which allows a plurality of semiconductor chips to let a current flow uniformly therethrough and a method of manufacturing the same. The semiconductor device (1) in accordance with one embodiment comprises a plurality of first semiconductor chips (10 1 to 10 N ) and a circuit board (30), mounted with the plurality of the first semiconductor chips, having first and second wiring conductors (32A, 32B) electrically connected to the plurality of first semiconductor chips. The plurality of first semiconductor chips are connected in parallel together with the first and second wiring conductors so as to construct a first parallel circuit (60). The plurality of first semiconductor chips are arranged on the circuit board according to an on-resistance of the plurality of first semiconductor chips so that a uniform current flows through the plurality of first semiconductor chips.
Inventors:
Satoshi Hatsukawa
Application Number:
JP2012145086A
Publication Date:
June 22, 2016
Filing Date:
June 28, 2012
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2003060157A | ||||
| JP63056830U | ||||
| JP9008280A | ||||
| JP2008187151A | ||||
| JP2011243847A | ||||
| JP2000311983A |
Foreign References:
| WO2013179547A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Ichira Kondo
Kenichiro Wada
Yoshiki Kuroki
Ichira Kondo
Kenichiro Wada