Title:
The manufacturing method of a semiconductor device, and a semiconductor device
Document Type and Number:
Japanese Patent JP6050075
Kind Code:
B2
Inventors:
Kinuta Seizen
Application Number:
JP2012213074A
Publication Date:
December 21, 2016
Filing Date:
September 26, 2012
Export Citation:
Assignee:
Optonix Precision Co., Ltd.
International Classes:
C25D7/12; C25D5/00; C25D15/02; H01L21/02; H01L21/20
Domestic Patent References:
JP2007534164A |
Foreign References:
WO2000034539A1 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda
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