Title:
SEMICONDUCTOR MODULE, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2018190866
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor module and a method of manufacturing the same capable of protecting a bonding wire.SOLUTION: A method of manufacturing a semiconductor module according to one embodiment is a method of manufacturing a semiconductor module 1 that comprises: a base 3; and a housing 2 arranged on the base 3 and that has a side wall defining an element mounting region between the base 3 and itself. The method includes the following steps of: mounting an element in the element mounting region; wire-bonding the element; filling the element mounting region with a solidification resin R having a viscosity equal to or more than 1 mPa S and equal to or less than 100 mPa S; and forming the solidification resin R immediately under a bonding wire W and between the base 3 and the bonding wire W.SELECTED DRAWING: Figure 8
Inventors:
INOUE SHINGO
YAMAMOTO HIRONOBU
YAMAMOTO HIRONOBU
Application Number:
JP2017093366A
Publication Date:
November 29, 2018
Filing Date:
May 09, 2017
Export Citation:
Assignee:
SEDI INC
International Classes:
H01L25/07; H01L21/60; H01L23/29; H01L23/31; H01L25/18
Domestic Patent References:
| JP2008251929A | 2008-10-16 | |||
| JP2013058606A | 2013-03-28 | |||
| JP2011057921A | 2011-03-24 | |||
| JP2011044628A | 2011-03-03 | |||
| JP2011228336A | 2011-11-10 | |||
| JPH08321567A | 1996-12-03 |
Foreign References:
| WO2007023852A1 | 2007-03-01 | |||
| WO2013145532A1 | 2013-10-03 | |||
| US20090032972A1 | 2009-02-05 | |||
| CN101248526A | 2008-08-20 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
High Kunio Ki
Yumoto Yuuji
Yoshiki Kuroki
High Kunio Ki
Yumoto Yuuji