センサの製造方法

Title:

センサの製造方法

Document Type and Number:

Japanese Patent JP5828049

Kind Code:

B2

Abstract:

The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

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Inventors:

Pearl, Wolfgang
Lightur, Anton
Portman, Jurgen
Robert Eichinger
Siegel, Christian
Nicolaus, Karl
Thomas Wasner
Zettlmeier, Thomas

Application Number:

JP2014558058A

Publication Date:

December 02, 2015

Filing Date:

February 08, 2013

Export Citation:

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Assignee:

EPCOS AG

International Classes:

H04R31/00; B81C3/00; H01L21/60; H01L29/84; H04R19/04

Domestic Patent References:

JP2007039672A
JP2011097311A
JP2008054007A

Foreign References:

WO2012004339A1
US20120093346

Attorney, Agent or Firm:

Koji Nagato

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