Title:
A manufacturing method of a sheet-shaped resin composition, the tape integral-type sheet-shaped resin composition for back grinding, a dicing tape integral-type sheet-shaped resin composition, and a semiconductor device, and a semiconductor device
Document Type and Number:
Japanese Patent JP6193627
Kind Code:
B2
Abstract:
A sheet-form resin composition used for sealing the interface between an adherend and a flip-chip-connected semiconductor element on the adherend, wherein the sheet-form resin composition has a weight decrease of no greater than 2% when the temperature is increased from 25 to 300°C at a rate of 10°C/min and a moisture absorptivity of no greater than 1% using the Karl Fischer method, and, relative to the entire sheet-shaped resin composition, contains 1-10 wt% of an organic acid having an acid dissociation constant of 3.0 to 5.0.
Inventors:
Hanazono Hiroyuki
Takamoto Naohide
Kosuke Morita
Akihiro Fukui
Takamoto Naohide
Kosuke Morita
Akihiro Fukui
Application Number:
JP2013118009A
Publication Date:
September 06, 2017
Filing Date:
June 04, 2013
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/60; C09J7/10; H01L21/301; H01L21/304
Domestic Patent References:
| JP2012160668A | ||||
| JP2002338932A | ||||
| JP2013065888A | ||||
| JP2009239138A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office