Title:
SOLDER WIRE FEEDING DEVICE, SOLDER FEEDING CONTAINER, ANE METHOD FOR MANUFACTURING THE SOLDER WIRE FEEDING DEVICE
Document Type and Number:
Japanese Patent JP2018001246
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a solder wire feeding device capable of reducing the possibility of loosening of a solder wire coil not used while holding a plurality of solder wire coils so as to enable selection of solder wires different in thickness, a solder feeding container, and a method for manufacturing the solder wire feeding device.SOLUTION: This solder wire feeding device is constructed such that a solder feeding container 2 having a cylindrical body 21 and a bottom plate 22 in which through-holes 23 and 24 are formed to store a first solder wire coil 103a of a first solder wire 102a and a second solder wire coil 103b of a second solder wire 102b different in thickness from the first solder wire 102a, the first solder wire 102a pulled out from a first hollow part 106a is pulled out through the through-hole 23, and the second solder wire 102b pulled out from a second hollow part 106b is pulled out through the first hollow part 106a and the through-hole 24.SELECTED DRAWING: Figure 2
Inventors:
NISHIMURA TETSURO
Application Number:
JP2016133891A
Publication Date:
January 11, 2018
Filing Date:
July 06, 2016
Export Citation:
Assignee:
NIHON SUPERIOR CO LTD
International Classes:
B23K3/06
Attorney, Agent or Firm:
Takao Yanagino
Norio Morioka
Hisayoshi Sekiguchi
Hiroto Onishi
Norio Morioka
Hisayoshi Sekiguchi
Hiroto Onishi