Title:
A manufacturing method of the substrate for light emitting diodes, and the substrate for light emitting diodes
Document Type and Number:
Japanese Patent JP6125527
Kind Code:
B2
Abstract:
A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.
Inventors:
Shino Yano
Nobu Tani
Hirokazu Nakanishi
Nobu Tani
Hirokazu Nakanishi
Application Number:
JP2014545471A
Publication Date:
May 10, 2017
Filing Date:
November 06, 2012
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L33/62; H01L23/12; H01L23/36
Domestic Patent References:
| JP2011205009A | ||||
| JP2009044027A | ||||
| JP2007123482A | ||||
| JP2010274256A | ||||
| JP2012109513A | ||||
| JP2011233775A | ||||
| JP2011040622A | ||||
| JP2008109079A | ||||
| JP2012084733A | ||||
| JP2008159791A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
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