Title:
A manufacturing method of the substrate for the substrate for luminescent devices, a luminescent device, and luminescent devices
Document Type and Number:
Japanese Patent JP6215360
Kind Code:
B2
Abstract:
Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate (20) for a light emitting device includes: a first insulating layer (11) having thermal conductivity which is formed on a surface of one side of a metal base (2); a wiring pattern (3) which is formed on the first insulating layer (11); and a second insulating layer (12) having light reflectivity which is formed on the first insulating layer (11) and on some parts of the wiring pattern (3), so that some parts of the wiring pattern (3) are exposed, in which the first insulating layer (11) is a layer of ceramic formed by thermal spraying.
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Inventors:
Masahiro Konishi
Shin Ito
Hiroyuki Nokubo
Itakura Yoshiaki
Shin Ito
Hiroyuki Nokubo
Itakura Yoshiaki
Application Number:
JP2015556735A
Publication Date:
October 18, 2017
Filing Date:
December 04, 2014
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L33/48; H01L33/60; H05K1/05
Domestic Patent References:
| JP2011187752A | ||||
| JP2012243846A | ||||
| JP2000174350A | ||||
| JP2007317701A | ||||
| JP2010199203A | ||||
| JP2012102007A | ||||
| JP2013153068A | ||||
| JP2012089357A |
Foreign References:
| WO2013183693A1 | ||||
| WO2009145109A1 | ||||
| WO2010021089A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark
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