Title:
A manufacturing method of the substrate for power modules with a heat sink
Document Type and Number:
Japanese Patent JP5966790
Kind Code:
B2
More Like This:
| JP2000216305 | HEAT SINK, ITS USING METHOD, AND ITS MANUFACTURING |
| JP2014033167 | SEMICONDUCTOR DEVICE |
| WO/2022/249804 | SEMICONDUCTOR DEVICE |
Inventors:
Tomoya Okai
Application Number:
JP2012200675A
Publication Date:
August 10, 2016
Filing Date:
September 12, 2012
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L23/36; B23K1/00; B23K1/19; B23K35/28; C22C21/06; C22F1/047; H01L23/12; H01L23/373; H05K1/02
Domestic Patent References:
| JP2012156211A | ||||
| JP2004158659A | ||||
| JP2002098454A | ||||
| JP2011100672A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa
Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa
Previous Patent: An inspection device, an image forming device, and an inspection method
Next Patent: AUTOMATIC FAIR COPY MACHINE
Next Patent: AUTOMATIC FAIR COPY MACHINE