Title:
A manufacturing method, a substrate processing device, and a program of a semiconductor device
Document Type and Number:
Japanese Patent JP6022276
Kind Code:
B2
Inventors:
Ryota Sasashima
Yoshinobu Nakamura
Kazuyuki Okuda
Yoshinobu Nakamura
Kazuyuki Okuda
Application Number:
JP2012207602A
Publication Date:
November 09, 2016
Filing Date:
September 20, 2012
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/314; C23C16/36; C23C16/40; H01L21/31; H01L21/316; H01L21/318
Domestic Patent References:
| JP2007189173A | ||||
| JP2006351806A | ||||
| JP2011238894A | ||||
| JP2008511993A | ||||
| JP2011249480A | ||||
| JP2009147216A | ||||
| JP2011071510A |
Attorney, Agent or Firm:
Fukuoka Masahiro
Aniya Setsuo
Hitoshi Kiyono
Aniya Setsuo
Hitoshi Kiyono
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