Title:
A manufacturing method, a substrate processing device, and a program of a semiconductor device
Document Type and Number:
Japanese Patent JP6125946
Kind Code:
B2
Inventors:
Satoshi Shimamoto
▲ひろせ▼ 義朗
Atsushi Sano
▲ひろせ▼ 義朗
Atsushi Sano
Application Number:
JP2013165158A
Publication Date:
May 10, 2017
Filing Date:
August 08, 2013
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/318; C23C16/42; C23C16/455; H01L21/31; H01L21/316
Domestic Patent References:
| JP2011192875A | ||||
| JP1195277A | ||||
| JP2014183218A |
Foreign References:
| US20130084714 | ||||
| US20060228903 |
Attorney, Agent or Firm:
Fukuoka Masahiro
Aniya Setsuo
Hitoshi Kiyono
Aniya Setsuo
Hitoshi Kiyono
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