Title:
A manufacturing method of a substrate processing device and a semiconductor device
Document Type and Number:
Japanese Patent JP6232164
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a process chamber and a transfer device configured to transfer a plurality of substrates to a substrate retainer. The transfer device includes a base; a first moving unit capable of linear motion; a first drive unit to drive the first moving unit. The first drive unit includes a first pulley group; a first motor coupled to a first pulley; and a first connecting member coupling the first belt and the first moving unit. A second moving unit is capable of linear motion. A second drive unit is in an enclosure of the first moving unit and drives the second moving unit. The second drive unit includes a second pulley group; a second belt wound on the second pulley group, a second motor coupled to drive a second pulley; and a second connecting member coupling the second belt and the second moving unit.
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Inventors:
Yasuaki Kozen
Takashi Nogami
Satoshi Taniyama
Shigeru Kotake
Takashi Nogami
Satoshi Taniyama
Shigeru Kotake
Application Number:
JP2017508292A
Publication Date:
November 15, 2017
Filing Date:
March 17, 2016
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/677; B25J9/06; B65G49/07
Domestic Patent References:
| JP2002190510A | ||||
| JP2011199121A | ||||
| JP2013239587A | ||||
| JP11043223A | ||||
| JP2014229757A | ||||
| JP2013150012A | ||||
| JP2004165579A |