Title:
Substrate and manufacturing method of substrate
Document Type and Number:
Japanese Patent JP6311081
Kind Code:
B2
Abstract:
A substrate (1) is provided with: a laminated wiring board (3) on which a plurality of conductive layers (2) are formed; a through hole (6) formed by penetrating the laminated wiring board (3); a through hole plating (7), which covers the inner wall of the through hole (6), and is electrically connected to the conductive layers (2); a metal piece (10), which is disposed on the inner side of the through hole plating (7), and is configured from a core section (8), and a film section (9) covering the whole surface of the core section (8); and an alloy film (11), which is disposed between the film section (9) and the through hole plating (7), and is formed of metals which the film section (9) and the through hole plating (7) are respectively formed of.
Inventors:
Yasuaki Seki
Junpei Takabayashi
Naoyuki Makino
Junpei Takabayashi
Naoyuki Makino
Application Number:
JP2017557575A
Publication Date:
April 11, 2018
Filing Date:
December 24, 2015
Export Citation:
Assignee:
Meiko Co., Ltd.
International Classes:
H05K1/11; H01L23/12; H05K3/40
Domestic Patent References:
| JP2002111159A | ||||
| JP201191116A | ||||
| JP2005294496A | ||||
| JP2003197835A | ||||
| JP2014207815A1 | ||||
| JP2014171004A1 | ||||
| JP200551088A | ||||
| JP2011159727A |
Foreign References:
| WO2013031815A1 |
Attorney, Agent or Firm:
Shigeru Arai
Previous Patent: An estimation method of a filter state estimation system and a filter state
Next Patent: RADIO COMMUNICATION MACHINE
Next Patent: RADIO COMMUNICATION MACHINE