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Patent Searching and Data


Title:
Substrate and manufacturing method of substrate
Document Type and Number:
Japanese Patent JP6311081
Kind Code:
B2
Abstract:
A substrate (1) is provided with: a laminated wiring board (3) on which a plurality of conductive layers (2) are formed; a through hole (6) formed by penetrating the laminated wiring board (3); a through hole plating (7), which covers the inner wall of the through hole (6), and is electrically connected to the conductive layers (2); a metal piece (10), which is disposed on the inner side of the through hole plating (7), and is configured from a core section (8), and a film section (9) covering the whole surface of the core section (8); and an alloy film (11), which is disposed between the film section (9) and the through hole plating (7), and is formed of metals which the film section (9) and the through hole plating (7) are respectively formed of.

Inventors:
Yasuaki Seki
Junpei Takabayashi
Naoyuki Makino
Application Number:
JP2017557575A
Publication Date:
April 11, 2018
Filing Date:
December 24, 2015
Export Citation:
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Assignee:
Meiko Co., Ltd.
International Classes:
H05K1/11; H01L23/12; H05K3/40
Domestic Patent References:
JP2002111159A
JP201191116A
JP2005294496A
JP2003197835A
JP2014207815A1
JP2014171004A1
JP200551088A
JP2011159727A
Foreign References:
WO2013031815A1
Attorney, Agent or Firm:
Shigeru Arai