Title:
A manufacturing method of the support jig for semiconductor wafers
Document Type and Number:
Japanese Patent JP6246671
Kind Code:
B2
Inventors:
Satoshi Odashima
Application Number:
JP2014145245A
Publication Date:
December 13, 2017
Filing Date:
July 15, 2014
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
H01L21/02; H01L21/683
Domestic Patent References:
| JP2009016430A | ||||
| JP2003246357A | ||||
| JP2006351817A | ||||
| JP5109879A | ||||
| JP2012169405A |
Foreign References:
| US8383460 |
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba