Title:
A manufacturing method of surface treatment copper foil, a copper-clad laminate sheet, and a printed wired board, a manufacturing method of a semiconductor package, and a manufacturing method of electronic equipment
Document Type and Number:
Japanese Patent JP6031624
Kind Code:
B2
More Like This:
Inventors:
Masashi Ishii
Akimasa Moriyama
Akimasa Moriyama
Application Number:
JP2016038108A
Publication Date:
November 24, 2016
Filing Date:
February 29, 2016
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
B32B15/08; B32B15/20; C25D1/04; C25D7/06; H05K3/38
Domestic Patent References:
| JP2013243396A | ||||
| JP6047755A |
Foreign References:
| WO2013183607A1 | ||||
| WO2014024878A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation