Title:
THERMALLY CONDUCTIVE FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2018010911
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive flexible printed wiring board capable of effectively facilitating the heat radiation of a heat source, and its manufacturing method.SOLUTION: A thermally conductive flexible printed wiring board according to one aspect of the present invention uses a double-side copper pasted plate including an insulation layer and a pair of copper foils laminated on both sides of the insulation layer. The thermally conductive flexible printed wiring board includes: a heat source implemented on a front face side; a heat sink portion arranged at a position away from the heat source and on the front face; and a copper foil continuous region continuing between the heat source and the heat sink portion.SELECTED DRAWING: Figure 1
Inventors:
MURATA KAZUO
UCHIDA YOSHIFUMI
UCHIDA YOSHIFUMI
Application Number:
JP2016137300A
Publication Date:
January 18, 2018
Filing Date:
July 12, 2016
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUIT INC
International Classes:
H05K1/02
Domestic Patent References:
| JP2011091142A | 2011-05-06 | |||
| JP2007294619A | 2007-11-08 | |||
| JP2004128418A | 2004-04-22 | |||
| JP2012060043A | 2012-03-22 |
Foreign References:
| US20060250780A1 | 2006-11-09 |
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka