Title:
THREE-DIMENSIONAL MOLDING DEVICE AND METHOD FOR PRODUCING MOLDING
Document Type and Number:
Japanese Patent JP2018140643
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique capable of finely peeling a hardening layer of a material from a regulation body of regulating a surface of a material forming a molding, increasing flatness of each layer, or controlling a thickness of each layer at high precision.SOLUTION: A three-dimensional molding device comprises a stage 15 and a surface (an outer peripheral surface 10a of a drum 10), and is provided with a regulation body (the drum 10) arranged by facing to the stage in such a manner that a region of a part of the surface is made closer to the stage than other regions, an irradiation unit for irradiating energy rays to a slit region S that is a region between the stage side and a region A1 of a part of the surface, and a movement mechanism for relatively moving the stage and the regulation body.SELECTED DRAWING: Figure 6
Inventors:
YASUKOCHI HIROYUKI
Application Number:
JP2018097816A
Publication Date:
September 13, 2018
Filing Date:
May 22, 2018
Export Citation:
Assignee:
SONY CORP
International Classes:
B29C64/241; B29C64/106; B29C64/209; B29C64/236; B29C64/245; B29C64/264; B29C64/35; B33Y10/00; B33Y30/00; B33Y40/00
Domestic Patent References:
| JP2009543716A | 2009-12-10 | |||
| JPH05237942A | 1993-09-17 | |||
| JP2003251701A | 2003-09-09 |
Attorney, Agent or Firm:
Junichi Omori
Teppei Nakamura
Ori Akira
Ayako Kaneko
Teppei Nakamura
Ori Akira
Ayako Kaneko