Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
A manufacturing method of an ultrasonic probe and an ultrasonic probe
Document Type and Number:
Japanese Patent JP5954773
Kind Code:
B2
Abstract:
A backing material is provided on the back face side of a piezoelectric transducer, with a first width substantially equal to the piezoelectric transducer widthwise and perpendicular to the radiation direction. A front face of a layer located on the front face side with regard to a wiring pattern has a width substantially equal to the first width. Moreover, the back face of this layer has a second width shorter than the first width. A space is provided between this layer and the backing material due to the difference between the first width and the second width of this layer, and a covering member covering the wiring pattern covers the wiring pattern extending at least from the folded section of the flexible substrate into the space.

Inventors:
Kengo Okada
Hiroyuki Shikata
Minoru Aoki
Satoshi Tezuka
Hirohisa Makita
Application Number:
JP2012055236A
Publication Date:
July 20, 2016
Filing Date:
March 13, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toshiba Medical Systems Corporation
International Classes:
H04R17/00; H04R31/00
Domestic Patent References:
JP62140451U
JP2000107180A
JP61194999A
Attorney, Agent or Firm:
Misawa patent office