Title:
A manufacturing method of an ultrasound probe, an ultrasound probe, and ultrasonic diagnostic equipment
Document Type and Number:
Japanese Patent JP6189033
Kind Code:
B2
Abstract:
Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.
Inventors:
Shuntaro Machida
Akifumi Sako
Taiichi Takezaki
Tamotsu Yoshimura
Tatsuya Nagata
Naoaki Yamashita
Hiroki Tanaka
Akifumi Sako
Taiichi Takezaki
Tamotsu Yoshimura
Tatsuya Nagata
Naoaki Yamashita
Hiroki Tanaka
Application Number:
JP2012273688A
Publication Date:
August 30, 2017
Filing Date:
December 14, 2012
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H04R31/00; A61B8/00; H04R19/00
Domestic Patent References:
| JP2008008729A | ||||
| JP2010035156A | ||||
| JP2010139313A | ||||
| JP2012010158A |
Foreign References:
| WO2009139400A1 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
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