Title:
The manufacturing method of the wiring board for light emitting element loading, and the wiring board for light emitting element loading, a light emitting element mounting wiring board
Document Type and Number:
Japanese Patent JP5973355
Kind Code:
B2
Inventors:
Takahiro Hayashi
Makoto Nagai
Makoto Nagai
Application Number:
JP2013003535A
Publication Date:
August 23, 2016
Filing Date:
January 11, 2013
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01L33/60; H01L23/12
Domestic Patent References:
| JP2011151323A | ||||
| JP2008124297A | ||||
| JP2005191111A | ||||
| JP2010278317A | ||||
| JP2011166035A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office
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