Title:
配線膜の製造方法
Document Type and Number:
Japanese Patent JP5865634
Kind Code:
B2
Abstract:
An Al wiring film having a tapered shape is obtained easily and in a stable manner. An Al wiring film has a double-layer structure including a first Al alloy layer made of Al or an Al alloy, and a second Al alloy layer laid on the first Al alloy layer and having a composition different from a composition of the first Al alloy layer by containing at least one element of Ni, Pd, and Pt. The second Al alloy layer is etched by an alkaline chemical solution used in a developing process of a photoresist, and an end portion of the second Al alloy layer recedes from an end portion of the photoresist. Thereafter, by performing wet etching using the photoresist as a mask, a cross section of the Al wiring film becomes a tapered shape.
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Inventors:
Kazuyuki Fujiwara
Inoue Japanese style
Takato Yamabe
Inoue Japanese style
Takato Yamabe
Application Number:
JP2011193849A
Publication Date:
February 17, 2016
Filing Date:
September 06, 2011
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G02F1/1368; C22C21/00; G02F1/1343; G09F9/30; H01B5/02; H01B13/00; H01L21/28; H01L21/306; H01L21/3205; H01L21/768; H01L23/532; H01L29/41; H01L29/786
Domestic Patent References:
JP2008098611A | ||||
JP2005303003A | ||||
JP2006191013A |
Foreign References:
WO2008047667A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita