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Title:
多孔状基板上にパターン電極をコンタクトさせる方法とその素子
Document Type and Number:
Japanese Patent JP2007534162
Kind Code:
A
Abstract:
A method for contacting patterned electrode devices includes the steps of providing a porous substrate, depositing electrically conductive material to form at least one electrode on a front-side of the porous substrate and depositing at least one electrically conductive back-side contact trace on the back-side of the substrate. A portion of the electrically conductive material penetrates into the substrate. A device is formed including the electrode on the front side of the substrate, wherein the electrode is electrically coupled by a conducting channel including the electrically conductive material through the substrate to the back-side contact trace.

Inventors:
Reynolds, John Earl.
Argan, Abniey.
Berard, Mathieu
Aubert, Pierre Ash.
Application Number:
JP2006541362A
Publication Date:
November 22, 2007
Filing Date:
November 19, 2004
Export Citation:
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Assignee:
University of Florida Research Foundation, Inc.
International Classes:
H01L21/768; G02F1/15; G02F1/155; H01G7/00; H01L51/00; H02N2/00; H01L21/316; H01L27/32
Domestic Patent References:
JPH04204521A1992-07-24
JPS61145536A1986-07-03
JP2005510619A2005-04-21
JPH11168104A1999-06-22
JP2003251737A2003-09-09
JP2004006290A2004-01-08
JPH0372328A1991-03-27
JPH0429220A1992-01-31
JPH01213625A1989-08-28
Foreign References:
WO2003046106A12003-06-05
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda