Title:
PIEZOELECTRIC RESONATOR CHIP AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3139139
Kind Code:
B2
Abstract:
PURPOSE: To make small sized and light weight by molding a piezoelectric resonator or the like with an outer package resin.
CONSTITUTION: A piezoelectric resonator element is led to a position corresponding to each terminal electrode and placed on an insulation board (e.g. ceramic board) 30 having electrodes 32-34, each terminal electrode of the piezoelectric resonator element and each of the electrodes 32-34 of the board 30 are molten through conduction, a rubber elastic body made of a silicone rubber or the like to cover part of the vibration electrode of the piezoelectric resonator element is provided, and the element is molded by an electric insulating outer package resin 40 such as epoxy resin to form a chip component. Side face electrodes 52-54 are used on the surface of the chip component so as to connect each of the lead electrodes 32-34 and external electrodes 42-44 on the surface, respectively. Thus, small size and lightweight is attained for the resonator by using mold by an outer package resin without the use of a ceramic-made case.
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Inventors:
Takashi Yoshinaga
Application Number:
JP17200692A
Publication Date:
February 26, 2001
Filing Date:
June 05, 1992
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H03H3/02; H03H9/02; H03H9/54; H03H9/56; (IPC1-7): H03H9/54; H03H3/02; H03H9/02
Domestic Patent References:
| JP477011A | ||||
| JP63104508A | ||||
| JP491510A | ||||
| JP1228310A | ||||
| JP443018U | ||||
| JP434013U | ||||
| JP3120119U | ||||
| JP25923U | ||||
| JP62141213U | ||||
| JP6226924U | ||||
| JP2134734U |
Attorney, Agent or Firm:
Keiji Yamamoto
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