Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
A material heat propagation simulation device of a thermal cutting processing machine
Document Type and Number:
Japanese Patent JP5971001
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a material heat transmission simulation device for a thermal cutting machine, capable of simulating what kind of temperature change occurs at a material according as cutting by the thermal cutting machine proceeds.SOLUTION: The device simulates a heat transmission state of material W at a cutting process by a thermal cutting machine such as a laser beam machine, or the like. There is created a voxel model M in which each voxel S is made to have temperature by performing voxel approximation for the material W, and which gives diffusion coefficients indicating the degree of heat transmission easiness, to between adjacent voxels and between a voxel and space respectively. There are provided: means 5 for calculating an area Ra to be cut in each unit time, on a cutting route R of the material; means 6 for calculating a voxel S into which heat should be inputted; means 7 for setting heat input temperature for each voxel S in the area Ra; and means 9 for calculating temperature change with a diffusion equation for each voxel S, using the heat input temperature and the diffusion coefficients.

Inventors:
Tatsuki Hashimoto
Application Number:
JP2012163291A
Publication Date:
August 17, 2016
Filing Date:
July 24, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Murata Machinery Co., Ltd.
International Classes:
B23K26/00; B23K7/00; B23K10/00; B23K15/08; B23K26/38; G06F17/50
Domestic Patent References:
JP2008217269A
JP2008073742A
JP2009221046A
JP2001356804A
JP5089251A
JP3090962A
JP2007210527A
JP2000122521A
Attorney, Agent or Firm:
Masashi Noda
Shuji Sugimoto
Kenro Tsutsumi