Title:
EPISULFIDE COMPOUND AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP3230025
Kind Code:
B2
Abstract:
PURPOSE: To provide a new compound having a specific structure and low in dielectric constant, thus capable of giving copper-clad laminated boards suitable as multilayer printed wiring boards low in dielectric constant and excellent in heat resistance and low water-absorbency to be used for high-speed operation processing.
CONSTITUTION: The objective episulfide compound of formula I (n is 0-10; R and R' are each H, 1-10C alkyl, etc.; R1 to R4 are each 1-10C alkyl, 5-7C cycloalkyl, etc.). The compound of the formula I can be obtained, for example, by dehydrohalogenating reaction of a bisphenol compound of formula II such as 1,1-bis(5-t-butyl-4-hydroxy-2-methylphenyl)butane with an epihalohydrin such as epichlorohydrin in the presence of a base to produce an epoxy compound of formula III which is, in turn, reacted with a thiocyanate such as potassium thiocyanate.
Inventors:
Youichi Ueda
Hisashi Morimoto
Shinichiro Kitayama
Michio Suzuki
Yoshihide Masuda
Kazuo Sakiyama
Hisashi Morimoto
Shinichiro Kitayama
Michio Suzuki
Yoshihide Masuda
Kazuo Sakiyama
Application Number:
JP28797893A
Publication Date:
November 19, 2001
Filing Date:
November 17, 1993
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
Sumitomo Seika Co., Ltd.
Sumitomo Seika Co., Ltd.
International Classes:
C07D331/02; C08G75/02; C08G75/0236; C08G75/06; H05K1/03; (IPC1-7): C07D331/02; C08G75/06
Domestic Patent References:
| JP62184027A |
Attorney, Agent or Firm:
Takashi Kuboyama (1 person outside)