Title:
計測システム、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する方法、およびコンピュータに、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する処理を実行させるためのプログラムを格納する記憶媒体
Document Type and Number:
Japanese Patent JP7341241
Kind Code:
B2
Abstract:
The present invention proposes a technique for enabling the execution of measurement processing without referring to a design drawing for which it is difficult to adjust or obtain parameters for image processing that requires knowhow. This measurement system according to the present disclosure refers to a learning model generated on the basis of teaching data, which is generated from a sample image of a semiconductor, and the sample image, generates a region-segmented image from an input image (measurement subject) of a semiconductor having a predetermined structure, and uses the region-segmented image to perform image measurement. Here, the teaching data is an image in which labels, which include a structure of the semiconductor in the sample image, are assigned to each pixel of the image, and the learning model includes parameters for deducing teaching data from the sample image (see indicator 1).
Inventors:
Ryu Yuba
Total Sakai
Satoshi Yamaguchi
Total Sakai
Satoshi Yamaguchi
Application Number:
JP2021541913A
Publication Date:
September 08, 2023
Filing Date:
August 30, 2019
Export Citation:
Assignee:
Hitachi High-Tech Co., Ltd.
International Classes:
H01L21/66; G01B15/00; G06T7/00
Domestic Patent References:
| JP2019110120A | ||||
| JP2018506168A |
Attorney, Agent or Firm:
Patent Attorney Corporation Hiraki International Patent Office