Title:
A measuring method of the angle of contact of underfill resin
Document Type and Number:
Japanese Patent JP6182873
Kind Code:
B2
Inventors:
Yuki Umemura
Nakamura Kiyoshi
Nakamura Kiyoshi
Application Number:
JP2013007184A
Publication Date:
August 23, 2017
Filing Date:
January 18, 2013
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H01L21/56; G01N13/00; H01L21/60
Domestic Patent References:
| JP200759441A | ||||
| JP2001116675A | ||||
| JP1152339A |
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