Title:
金属ベース基板
Document Type and Number:
Japanese Patent JP7147313
Kind Code:
B2
Abstract:
A metal base substrate (2) comprising: a metal base (10); an insulating layer (20); and a circuit layer (40), the metal base (2), the insulating layer (10) and the circuit layer (40) being laminated in an order, wherein the insulating layer (20) includes a resin, a film thickness of the circuit layer (40) is in a range of 10 µm or more and 1000 µm or less, and an average grain size, which is expressed by a unit of µm, and a purity, which is expressed by a unit of mass%, satisfy a formula (1) below, average grain size/(100-Purity) > 5(1).
Inventors:
Ishikawa Shiro
Nonaka Sohei
Nonaka Sohei
Application Number:
JP2018134789A
Publication Date:
October 05, 2022
Filing Date:
July 18, 2018
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H05K1/05; H01L23/12; H01L23/14; H05K1/09; H05K3/34
Domestic Patent References:
| JP2011146679A | ||||
| JP2000256081A | ||||
| JP2007201359A | ||||
| JP2006128286A |
Foreign References:
| US7957100 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
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