Title:
金属セラミック接合基板及び、その製造方法
Document Type and Number:
Japanese Patent JP6456676
Kind Code:
B2
Inventors:
Hiroshi Takamura
Suzuki Ryo
Suzuki Ryo
Application Number:
JP2014255472A
Publication Date:
January 23, 2019
Filing Date:
December 17, 2014
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
H01L23/13; C04B37/02; H01L23/12; H01L23/36; H01L23/373; H05K3/38
Domestic Patent References:
| JP5218229A | ||||
| JP60177634A | ||||
| JP2003267782A |
Foreign References:
| WO2011108498A1 | ||||
| WO2010137651A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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