Title:
金属ラミネートフィルム成形方法およびその成形装置
Document Type and Number:
Japanese Patent JP5611257
Kind Code:
B2
Abstract:
A punch (2) and a pad (5) are opposed to each other such that a molded portion (3a) of a metal laminate film (3) to be processed is interposed between the punch (2) and the pad (5). An enclosed space (6, 7) is compressed to raise only the temperature of the molded portion (3a) while keeping the vicinity of the molded portion (3a) at a low temperature (S1, S2). After that, the enclosed space (6, 7) is moved with respect to the molded portion (3a) to perform first molding (S3) on the molded portion (3a), and then gas in the enclosed space (6) is released to perform second molding (S4) on the molded portion (3a) by means of the punch (2) and the pad (5).
Inventors:
山本 英郎
Application Number:
JP2012055197A
Publication Date:
October 22, 2014
Filing Date:
March 13, 2012
Export Citation:
Assignee:
パナソニック株式会社
International Classes:
B21D22/20; B21D22/22; B21D24/00; B21D26/023
Attorney, Agent or Firm:
Patent business corporation Morimoto international patent firm
Previous Patent: バッテリ充放電システムおよび電力マネジメントシステム
Next Patent: INSTALLING METHOD FOR LITHOPRINTING PLATE TO PRINTER DRUM
Next Patent: INSTALLING METHOD FOR LITHOPRINTING PLATE TO PRINTER DRUM