Title:
シリコン粉砕物を低汚染で自動的に粉砕する方法
Document Type and Number:
Japanese Patent JP4351666
Kind Code:
B2
Abstract:
A device for converting broken silicon pieces for semiconductor or solar use to an even finer product also suitable for such uses includes a number of breaking tools with a surface of a hard wear-resistant material and has a breaking ratio of 1.5-3. Independent claims are also included for (1) a breaking and classifying device for production of finely crushed silicon for semiconductor or solar use comprising a device as above together with a feeder (especially a hopper), a classifier (especially a sieve) and a collector for the fine silicon, the collector especially being a manually operated container; and (2) automatic processes for production of fine silicon for direct use in semiconductors or in photovoltaic applications in which the finely crushed silicon is classified into a fraction with an edge length below or equal to the maximum required edge length and also a fraction of edge length above that required, both fractions being collected.
Inventors:
Karl Hesse
Franz Schleider
Franz Schleider
Application Number:
JP2005292549A
Publication Date:
October 28, 2009
Filing Date:
October 05, 2005
Export Citation:
Assignee:
Wacker Chemie AG
International Classes:
B02C1/02; B02C2/02; B02C4/02
Domestic Patent References:
| JP57067019A | ||||
| JP58145611A | ||||
| JP2004161595A | ||||
| JP2152554A |
Foreign References:
| GB2025260A | ||||
| DE4316626A1 |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel