ルテニウム及び銅を含有する基板を化学的機械的研磨するための方法 - Rohm and Haas Electronic Materials CMP Housings, Inc.

Title:

ルテニウム及び銅を含有する基板を化学的機械的研磨するための方法

Document Type and Number:

Japanese Patent JP6538464

Kind Code:

B2

Abstract:

A method for chemical mechanical polishing of a substrate comprising ruthenium and copper is provided wherein the substrate is contacted with a polishing slurry containing an abrasive, hypochlorite, a copolymer of acrylic acid and methacrylic acid, benzotriazole, poly(methyl vinyl ether) and a non-ionic surfactant at a pH of 9 to 11.

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Inventors:

Hong Yu Wan
Lee Melbourne Cook
Ji Yun-Fan One
Chin-Sun Chao

Application Number:

JP2015144635A

Publication Date:

July 03, 2019

Filing Date:

July 22, 2015

Export Citation:

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Assignee:

Rohm and Haas Electronic Materials CMP Housings, Inc.

International Classes:

B24B37/00; H01L21/304; C09K3/14

Domestic Patent References:

JP2013062516A
JP2007214155A

Foreign References:

WO2007132933A1

Attorney, Agent or Firm:

Patent business corporation Tsukuni

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