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Title:
温度較正の方法および構成
Document Type and Number:
Japanese Patent JP2007527990
Kind Code:
A
Abstract:
The invention concerns an arrangement on a semiconductor chip for calibrating temperature setting curve having a signal generation unit (2) for providing a first signal (Iptat1, Vptat1, fptat1), which is proportional to the actual uncalibrated temperature T1 of the chip. To avoid bringing the chip on a second temperature it is proposed to read a first signal (Iptat1, Vptat1, fptat1), which is proportional to the actual uncalibrated temperature T1 of the chip and generate a signal offset (Ivirt, Vvirt, fvirt), which is combined with the first signal (Iptat1, Vptat1, fptat1) defining a second signal (Iptat2, Vptat2, fptat2) and to extract a first actual temperature T1 from the first signal (Iptat1, Vptat1, fptat1) and a second uncalibrated temperature T2 from the second signal (Iptat2, Vptat2, fptat2).

Inventors:
Sasha and Romia
Patrick, El Hafen
Application Number:
JP2006516733A
Publication Date:
October 04, 2007
Filing Date:
June 22, 2004
Export Citation:
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Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
G01K7/01; G01K15/00
Domestic Patent References:
JPH0979916A1997-03-28
JPS6341013B21988-08-15
JP2001116630A2001-04-27
JPH09297070A1997-11-18
JPH07198412A1995-08-01
Foreign References:
US6183131B12001-02-06
US20020173930A12002-11-21
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki



 
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