To well recognize defect when a crack is generated in a solder ball with a package using the solder ball such as a BGA package and CSP mounted on an equipment.
In a system substrate 50 whereon a BGA package 51 with a solder ball 53 is mounted, a wiring pattern 57 which is led out from solder balls 53(53a, 53b, 53c, 53d) in a plurality of places of the BGA package 51 is formed when the system substrate 50 is mounted on an electronic equipment. A crack detection circuit 70 connected to the wiring pattern 57 includes an OR circuit 76 which detects abnormality in the solder balls 53(53a, 53b, 53c, 53d) in a plurality of places, and a selector circuit 75 which identifies an abnormal solder ball 53 among the solder balls 53(53a, 53b, 53c, 53d) in the plurality of places. The detection result and identification result of the abnormality are notified to a system side.
COPYRIGHT: (C)2007,JPO&INPIT
Ken Sasaki
Shinji Matsushima
Mina Ogawa
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