Title:
プロファイル付けされた物品をフォーミング加工するための方法及び装置
Document Type and Number:
Japanese Patent JP6502391
Kind Code:
B2
Abstract:
An apparatus (40) for forming a profiled article (46) comprises: a forming path (41) through which a blank of deformable material to be formed into the profiled article passes; a pair of complementary and opposing body forming die members (45, 45′) adapted to travel along the forming path (41); and a drive (44, 44′) that facilitates travel of the body forming die members (45, 45′) along the forming path (41), wherein the pair of body forming die members (45, 45′) is adapted to act on the blank of deformable material independently to form a desired profile on the blank. Locating elements (75) that locate the blanks may be provided. A method of forming material is also provided. Further, there is provided a length of deformable material for use with the apparatus.
Inventors:
Din, Shi Chao
Din, Seepen
Din, Seepen
Application Number:
JP2016570146A
Publication Date:
April 17, 2019
Filing Date:
February 24, 2015
Export Citation:
Assignee:
SNS Unicorp Pty Limited
International Classes:
B21D5/06; B21D7/08; B21D43/00
Domestic Patent References:
| JP2013533806A | ||||
| JP2009208104A | ||||
| JP2007301594A | ||||
| JP2012166222A |
Foreign References:
| US3620065 |
Attorney, Agent or Firm:
Yusuke Hiraki
Toshiaki Watanabe
Ishikawa Takiharu
Naoki Takemura
Toshiaki Watanabe
Ishikawa Takiharu
Naoki Takemura