Title:
ELECTRIC LOADING VACUUM PLATING CELL
Document Type and Number:
Japanese Patent JP2014139341
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus which prevent bubble formation during immersion of a wafer and reduce the immersion time so as to maximize the plating uniformity of the wafer.SOLUTION: A substrate is immersed in an electrolyte in an electric plating cell 601 under a reduced-pressure condition of 100 torr or lower, preferably 20 torr or lower, to reduce or eliminate formation and/or capture of bubbles produced on immersion of a substrate. A variety of electrolyte recirculation loops for supplying an electrolyte to the plating cell 601 are disclosed. The recirculation loop may include a pump 606, a deaerator 608, a sensor 614, and a valve. Disclosed embodiments enable quick immersion of a substrate and substantial reduction of problems related to formation of bubbles and uneven plating times during electric plating.
Inventors:
STOWELL MARSHALL R
FENG JINGBIN
DAVID PORTER
FENG JINGBIN
DAVID PORTER
Application Number:
JP2013256183A
Publication Date:
July 31, 2014
Filing Date:
December 11, 2013
Export Citation:
Assignee:
NOVELLUS SYSTEMS INC
International Classes:
C25D21/04; C25D7/12; C25D17/00; C25D17/06; C25D17/08
Domestic Patent References:
| JPH02236295A | 1990-09-19 | |||
| JP2000345398A | 2000-12-12 | |||
| JP2001316889A | 2001-11-16 | |||
| JP2006525429A | 2006-11-09 | |||
| JP2003535223A | 2003-11-25 |
Foreign References:
| US6551487B1 | 2003-04-22 | |||
| WO2001068952A1 | 2001-09-20 |
Attorney, Agent or Firm:
Meisei International Patent Office
Takao Igarashi
Takao Igarashi