Title:
A method and a device which classify a flaw using a surface height attribute
Document Type and Number:
Japanese Patent JP6188695
Kind Code:
B2
Abstract:
One embodiment relates to a method of classifying a defect on a substrate surface. The method includes scanning a primary electron beam over a target region of the substrate surface causing secondary electrons to be emitted therefrom, wherein the target region includes the defect. The secondary electrons are detected from the target region using a plurality of at least two off-axis sensors so as to generate a plurality of image frames of the target region, each image frame of the target region including data from a different off-axis sensor. The plurality of image data frames are processed to generate a surface height map of the target region, and surface height attributes are determined for the defect. The surface height attributes for the defect are input into a defect classifier. Other embodiments, aspects and features are also disclosed.
Inventors:
Chiang Chien-Houay
Yang Hoa Dawn
Techo
Yang Hoa Dawn
Techo
Application Number:
JP2014534587A
Publication Date:
August 30, 2017
Filing Date:
September 20, 2012
Export Citation:
Assignee:
KLA-Tenker Corporation
International Classes:
G01N23/225; G01B15/00; G01B15/08; H01J37/22; H01L21/66
Domestic Patent References:
| JP2002520591A | ||||
| JP2002116161A | ||||
| JP2009270976A | ||||
| JP2006113073A | ||||
| JP2007531864A |
Foreign References:
| WO2005017511A1 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office
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