Title:
METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2017075791
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a device for measuring the state of deformation of the substrate of a semiconductor device.SOLUTION: A semiconductor device 30 includes: a substrate 31 with a first surface 31a and a second surface 31b; and an element layer 32 on the first surface side. A light transmitting through the substrate 31 is applied to the second surface 31b and an interference figure is obtained by using a light reflected from the semiconductor device 30.SELECTED DRAWING: Figure 4
Inventors:
YAMAZAKI KAZUHISA
Application Number:
JP2015201948A
Publication Date:
April 20, 2017
Filing Date:
October 13, 2015
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
G01B11/16
Domestic Patent References:
| JP2011080960A | 2011-04-21 | |||
| JP2013172057A | 2013-09-02 | |||
| JPH09511328A | 1997-11-11 | |||
| JP2006343100A | 2006-12-21 | |||
| JP2004294155A | 2004-10-21 |
Foreign References:
| US20150243024A1 | 2015-08-27 |
Attorney, Agent or Firm:
Atsushi Aoki
Koichi Itsubo
Tsutomu Kono
Tetsuo Miyamoto
Koichi Itsubo
Tsutomu Kono
Tetsuo Miyamoto