Title:
熱を発生するデバイスにおける所望のホットスポットを冷却するための柔軟な流体輸送のための方法及び装置
Document Type and Number:
Japanese Patent JP2006514734
Kind Code:
A
Abstract:
A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
More Like This:
Inventors:
Kenny, Thomas, William, Jr.
Shook, James, Gil
Munch, Mark
Upadaya, Greek
Elephant and bread
Kennis, Goodson, Yi.
Corbin, David
Shook, James, Gil
Munch, Mark
Upadaya, Greek
Elephant and bread
Kennis, Goodson, Yi.
Corbin, David
Application Number:
JP2005502178A
Publication Date:
May 11, 2006
Filing Date:
October 09, 2003
Export Citation:
Assignee:
Courigi Inc.
International Classes:
F28F7/00; B81B1/00; F04B17/00; F04B19/00; F28D15/02; F28F3/12; G06Q20/20; H01L23/473; H04L29/06
Attorney, Agent or Firm:
Akira Koike
Eiichi Tamura
Seiji Iga
Eiichi Tamura
Seiji Iga