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Title:
電気化学的に成型加工され、気密的に封止された微細構造および上記微細構造を製造するための方法および装置
Document Type and Number:
Japanese Patent JP4554357
Kind Code:
B2
Abstract:
In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Inventors:
Cohen, Adam, Elle.
Rockard, Michael, S.
Smalley, Dennis, Earl.
Alert, basit
Lee, Christopher, Jay.
Application Number:
JP2004503691A
Publication Date:
September 29, 2010
Filing Date:
May 07, 2003
Export Citation:
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Assignee:
Micro fabrica ink
International Classes:
C25D1/00; B81B3/00; B81C1/00; G01P15/08; G01P15/125; H01P1/202; H01P3/06; H01P5/18; H01P11/00; H05K3/46
Domestic Patent References:
JP2000513768A
JP5063103A
JP52032269A
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno