Title:
A method for film deposition of an electrical resistance thin film layer, and a manufacturing method of a copper-clad laminate sheet
Document Type and Number:
Japanese Patent JP6281215
Kind Code:
B2
Inventors:
Yoshiyuki Asakawa
Application Number:
JP2013184721A
Publication Date:
February 21, 2018
Filing Date:
September 06, 2013
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C23C14/58; B32B15/08; C23C14/14; H05K1/09; H05K1/16
Domestic Patent References:
| JP2011044522A |
Foreign References:
| WO2009075212A1 | ||||
| WO2008056755A1 |
Attorney, Agent or Firm:
Yoshitaka Oshida