Title:
触媒を用いた無電解めっきによりパターン化された絶縁体上に金属層を形成する方法
Document Type and Number:
Japanese Patent JP5214092
Kind Code:
B2
Abstract:
A metal layer is maybe formed by means of a plating process on a surface region of an underlying material catalytically activated in that a catalyst is deposited or incorporated by CVD, PVD or ALD at least partially during the deposition of the underlying material. In this way, superior metal seed layers may be formed in high aspect ratio vias of metallization structures.
Inventors:
Marx Knopper
Accel Ploise
Accel Ploise
Application Number:
JP2004567443A
Publication Date:
June 19, 2013
Filing Date:
December 22, 2003
Export Citation:
Assignee:
ADVANCED MICRO DEVICES INCORPORATED
International Classes:
C23C18/16; C25D5/54; C25D7/12; H01L21/288; H01L21/3205; H01L21/768; H01L23/532
Domestic Patent References:
| JP2002203859A | ||||
| JP883796A |
Foreign References:
| US6479902 |
Attorney, Agent or Firm:
Yuji Hayakawa
Keisuke Murasame
Keisuke Murasame
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