Title:
相互接続性導電性ナノ構造体の薄膜を基体上に形成する方法
Document Type and Number:
Japanese Patent JP6738574
Kind Code:
B2
Abstract:
Disclosed herein is a method, comprising forming a thin film of interconnecting conductive nanostructures on a substrate by depositing an ink composition on the substrate, wherein the ink composition comprises a plurality of conductive nanostructures, a binding material, a photosensitive compound, and a polar solvent; and removing the polar solvent; and exposing a portion of the thin film to a UV light source to cause the crosslinkable polymer in the exposed portion of the thin film to crosslink.
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Inventors:
Alemand, Pierre-Mark
Application Number:
JP2018182981A
Publication Date:
August 12, 2020
Filing Date:
September 27, 2018
Export Citation:
Assignee:
Cambrios Film Solutions Corporation
International Classes:
C09D11/52; H01B1/22; H01B5/14
Domestic Patent References:
| JP2008243600A | ||||
| JP2008274096A |
Foreign References:
| US20090321113 |
Attorney, Agent or Firm:
Kazuhiro Kiyohara