A method in relation to a stable chemical mechanical polish constituent and it which can be condensed - Rohm and Haas Electronic Materials CMP Housings, Inc.

Title:

A method in relation to a stable chemical mechanical polish constituent and it which can be condensed

Document Type and Number:

Japanese Patent JP6118502

Kind Code:

B2

Abstract:

A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

Inventors:

Hamed Laclaw
Jinjie C
Joseph Letizia
Shu Li
Thomas H. Calanter
Francis kelly
Jay Keith Harris
Christopher Jay Tucker

Application Number:

JP2012046433A

Publication Date:

April 19, 2017

Filing Date:

March 02, 2012

Export Citation:

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Assignee:

Rohm and Haas Electronic Materials CMP Housings, Inc.
Dow Global Technologies LLC

International Classes:

H01L21/304; B24B37/00; C09K3/14

Domestic Patent References:

JP2009256184A
JP200177063A
JP200891411A
JP2005347579A

Attorney, Agent or Firm:

Patent business corporation Tsukuni
Hajime Tsukuni
Yasuo Yanagibashi
Hidemi Kawada
Masatoshi Ando
Sugimoto Shoichi
Kurino Yuriko
Fusayuki Saito

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